The integrated processing solution combining photochemical etching and high-precision fiber laser cutting covers full-scenario manufacturing of semiconductor wafer fabrication, chip packaging, vacuum transmission, photoelectric auxiliary and fluid control components. Supported by ISO 9001:2015, ISO 14644 clean-room production management system, it adopts composite processing technology of stress-free chemical etching and high-precision laser cutting to solve processing difficulties of ultra-thin metal components, micro-hole array structures, high-flatness precision parts and electromagnetic shielding components. Compliant with SEMI semiconductor industry specifications, EU RoHS environmental standards and ultra-clean workshop production requirements, it supports supporting production for semiconductor fabs, packaging factories and semiconductor Tier 1 material suppliers.
Core Process Advantages for Semiconductor Components
Compared with traditional stamping forming, CNC milling and single laser processing, the dual-process collaborative mode fully meets ultra-clean, high-precision and low-pollution processing requirements of semiconductor precision components with stronger process adaptability:
-
Photochemical Etching Process: Adopt low-temperature chemical corrosion integrated forming technology with no mechanical extrusion stress during processing, featuring no plate deformation, burr-free cutting edge and no metal debris residue. It applies to processing of 0.01mm-3.0mm ultra-thin semiconductor metal components. No customized stamping mold is required, new product sample delivery can be completed within 3 working days with uniform and controllable etching depth. The finished components feature high flatness, ultra-clean surface and stable chemical resistance, meeting semiconductor vacuum and corrosive gas working conditions.
-
Precision Laser Cutting Process: Equipped with dust-free intelligent nesting system for automatic blanking, with extremely small heat-affected zone, no carbonization, no burr and no surface oxidation. Special-shaped non-standard parts, positioning assembly holes, vacuum flow holes and clamping grooves can be formed by one-time high-precision cutting with machining tolerance controlled within ±0.02mm. It supports flexible production switching for multi-specification small-batch orders, adapts to semiconductor product iteration rhythm and shortens component customized R&D cycle.
Applicable Materials for Semiconductor Processing
Custom processing available for full-range high-purity special metals for semiconductor industry as follows:
304/316L High-purity Stainless Steel, Aluminum Alloy, Oxygen-free Copper, Nickel Alloy, Titanium Alloy, Beryllium Copper, Molybdenum, Tungsten Copper, Corrosion-resistant Conductive Alloy
Full-range Processed Semiconductor Components
1. Wafer Fabrication & Process Cavity Components
-
Vacuum Chamber Etched Baffles, Gas Uniform Flow Orifice Plates
-
Wafer Positioning Shim, High-flatness Adjustment Spacer
-
Corrosion-resistant Liquid Distribution Filter Plate, Micro-channel Heat Dissipation Etched Parts
-
Plasma Process Grounding Elastic Contact Sheets
2. Chip Packaging & Testing Components
-
IC Packaging Shielding Frame, EMI/RFI Electromagnetic Shielding Shell
-
Test Probe Metal Reed, Precision Conductive Transition Sheet
-
Miniature SMT Positioning Fixture Sheet, Isolation Insulation Metal Gasket
3. Semiconductor Gas & Fluid Control Components
-
High-precision Micro-hole Gas Filter, Chemical Medium Anti-corrosion Etched Filter
-
Proportional Flow Control Metal Orifice, Vacuum Pressure Stabilizing Valve Plate
-
Multilayer Sintered Etched Flow Splitter Plate
4. Automation Transmission & Auxiliary Components
-
Robot Vacuum Suction Hole Plate, Wafer Anti-scratch Support Sheet
-
Equipment Wiring Harness Fixed Sheet, Dust-proof Hollow Protective Mesh
Process Pain Points, Solutions & Optimization Benefits
|
Traditional Processing Pain Points
|
Composite Process Solutions
|
Optimization Benefits
|
|
Stamping residual stress causes metal warpage, particle shedding contaminates semiconductor ultra-clean cavity
|
Whole-plate chemical etching forming with zero internal stress, no metal debris residue
|
Reduce cavity particle pollution rate, meet Class 100 clean-room assembly standard
|
|
Single laser processing produces oxide burrs, secondary polishing damages metal flatness
|
Laser contour cutting + integrated chemical micro-hole etching, one-step molding
|
Cancel secondary surface treatment, keep Ra≤0.8μm ultra-clean surface roughness
|
|
Semiconductor customized parts feature diverse specifications, high mold cost and long delivery cycle
|
Mold-free etching + programmable laser cutting for full digital flexible production
|
3-day rapid sampling, adapt to customized R&D iteration of semiconductor equipment parts
|
|
Batch dimensional tolerance deviation affects vacuum sealing and equipment fitting accuracy
|
Full-process precision inspection, unified size tolerance via automated production lines
|
Batch tolerance controlled within ±0.01mm, vacuum sealing qualification rate over 99.7%
|
